Tokyo Electron and IBM renew collaboration
New five-year agreement will focus on semiconductor and chiplet innovation for the age of generative AI.
Partnership Highlights
- • Extension of joint R&D agreement for advanced semiconductor technologies
- • Focus on next-generation semiconductor nodes and architectures
- • Emphasis on powering generative AI applications
- • Response to growing demand for efficient computing solutions
The renewed collaboration builds upon a more than two-decade partnership between IBM and TEL for joint research and development. Their shared history of innovation has yielded significant technological breakthroughs, including the development of a pioneering laser debonding process for producing 300 mm silicon chip wafers for 3D chip stacking technology. This advancement has been instrumental in enabling the development of more sophisticated and compact semiconductor designs.
In this next phase of their partnership, IBM and TEL will leverage their combined expertise to address the evolving challenges in semiconductor manufacturing. By bringing together IBM's deep knowledge in semiconductor process integration and TEL's state-of-the-art equipment capabilities, they will explore cutting-edge technology for smaller nodes and advanced chiplet architectures.
These innovations are crucial to meeting the increasingly demanding performance and energy efficiency requirements that will drive the future of generative AI applications.
"The work IBM and TEL have done together over the last 20 years has helped to push the semiconductor technology innovation to provide many generations of chip performance and energy efficiency to the semiconductor industry. We are thrilled to be continuing our work together at this critical time to accelerate chip innovations that can fuel the era of generative AI."
"IBM and Tokyo Electron have built a strong relationship of trust and innovation through years of joint development. We are excited to continue to build on our long-standing partnership with IBM for another five years. This renewed agreement underscores our mutual commitment to advancing semiconductor technologies, including patterning processes with High NA EUV."
Albany NanoTech Complex: A Hub of Innovation
The collaboration between IBM and TEL extends beyond their bilateral partnership through their involvement in the Albany NanoTech Complex, recognized as the world's premier ecosystem for semiconductor research, owned and operated by NY CREATES. This facility has become a cornerstone of semiconductor innovation, where IBM, TEL, and other industry leaders have worked collaboratively to establish the most advanced public-private semiconductor research facility globally.
Key Achievements
The significance of this research hub was further validated when it was designated as America's first National Semiconductor Technology Center, the NSTC EUV Accelerator, in the previous year. This designation underscores the facility's crucial role in advancing semiconductor technology and maintaining technological leadership in this strategic industry.
Under the terms of this new agreement, IBM and TEL researchers will continue their collaborative work at the Albany facility, leveraging its unique ecosystem and cutting-edge R&D capabilities. This renewed commitment to joint research and development positions both companies at the forefront of semiconductor innovation, ready to address the technological challenges and opportunities presented by the rapidly evolving landscape of artificial intelligence and advanced computing systems.